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    BCD

    TacuLee发表于 2016-10-05 15:36:26
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    (思维很发散的博主)在看Allen的《CMOS模拟集成电路设计》的时候,开始好奇除了CMOS工艺之外还有什么工艺适合做Mixed-Signal(“混合信号”被广泛接受用来描述在同一硅衬底上制作模拟和数字电路),查到了意法(ST)发明的BCD工艺,不过主要是用于功率管理、模拟数据采样和功率致动器,与博主所研究的方向基本无关,权作了解。

    BCD (BIPOLAR-CMOS-DMOS)[1] is a key technology for power ICs.  ST invented this technology—revolutionary at the time–in the mid-eighties and has continually developed it ever since. BCD is a family of silicon processes, each of which combines the strengths of three different process technologies onto a single chip: Bipolar for precise analog functions, CMOS (Complementary Metal Oxide Semiconductor) for digital design and DMOS (Double Diffused Metal Oxide Semiconductor) for power and high-voltage elements.

    This combination of technologies brings many advantages: Improved reliability, reduced electromagnetic interference and smaller chip area. BCD has been widely adopted and continuously improved to address a broad range of products and applications in the fields of power management, analog data acquisition and power actuators.

    Addressing a wide range of applications

    With know-how in process development and chip production honed over more than two decades, ST offers a unique range of BCD process technologies, each addressing specific application needs, with an optimal trade-off between functionality, performance and cost.

    The offer is divided into two types of BCD process:

    • High-voltage BCD, which enables reliable coexistence on the same chip of low-voltage control circuits and very high-voltage DMOS stages with typical voltage capability up to 800V. The integration of BCD on SOI (Silicon on Insulator) substrates addresses specific high-value applications in electromedical, automotive safety or audio.
    • High-density BCD is driven by the need to integrate more and more complex and diversified functions on the same chip and to guarantee high quality and reliability in all types of application environments.

    Driving innovation in BCD
    With its expertise in both “More-Moore” and “More-than-Moore” semiconductor technologies, ST has an unmatched capability to offer the best BCD solutions. By integrating DMOS architectures designed with a set of innovative techniques and taking advantage of state-of-the-art wafer-processing fabs, ST’s BCD offers best-in-class performance and the most advanced process nodes.

    Moreover, ST has the capability to customize its BCD technologies to optimally address the most demanding markets, including automotive, aerospace and certain segments of the industrial market. By taking into account all of the specificities of the targeted application from the earliest development stages ST can offer tailor-made solutions to its customers

    Capitalizing on the strong synergy between technology, design and application, ST has also developed a rich set of development tools to aid in the design process for customers, allowing fast introduction of powerful and robust products to the market.

    With its unique technical knowledge based on more than two decades of experience in the field, ST provides unrivaled technical support in order to guarantee the best BCD experience to its customers.

    参考文献

    [1] BCD



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